Cooling of electronic component with jet impingement boiling /
Saved in:
| 主要作者: | |
|---|---|
| 格式: | Thesis 圖書 |
| 語言: | English |
| 出版: |
2001.
|
| 主題: | |
| 標簽: |
添加標簽
沒有標簽, 成為第一個標記此記錄!
|
| LEADER | 00837cam a2200217 a 4500 | ||
|---|---|---|---|
| 001 | u696270 | ||
| 003 | SIRSI | ||
| 008 | 040526s2001 si v 00 0 eng m | ||
| 035 | |a ADB-3842 | ||
| 040 | |a UMM | ||
| 090 | |a TJ7 |b NUSP 2001 Yan | ||
| 100 | 1 | 0 | |a Yang, Cheng. |
| 245 | 1 | 0 | |a Cooling of electronic component with jet impingement boiling / |c Yang Cheng. |
| 260 | |c 2001. | ||
| 300 | |a xvii, 185 leaves ; |c 30 cm. | ||
| 502 | |a Thesis (Ph.D.) -- Dept. of Mechanical & Production Engineering, Faculty of Engineering, National University of Singapore, 2001. | ||
| 504 | |a Bibliography: leaves 175-185. | ||
| 650 | 0 | |a Electronic apparatus and appliances |x Cooling. | |
| 948 | |a 26/05/2004 |b 27/05/2004 | ||
| 596 | |a 1 | ||
| 999 | |a TJ7 NUSP 2001 YAN |w LC |c 1 |i A511136568 |d 24/8/2006 |f 24/8/2006 |g 1 |l B_KOM4 |m P01UTAMA |r Y |s Y |t TESIS |u 21/7/2005 |o .PUBLIC. bkom 4 : 45630 | ||