Wong, P. L. (2005). A reliability methodology for deep sub-micron interconnect metal liners.
Chicago Style (17th ed.) CitationWong, Poh Ling. A Reliability Methodology for Deep Sub-micron Interconnect Metal Liners. 2005.
MLA引文Wong, Poh Ling. A Reliability Methodology for Deep Sub-micron Interconnect Metal Liners. 2005.
警告:这些引文格式不一定是100%准确.