A reliability methodology for deep sub-micron interconnect metal liners /
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| Main Author: | |
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| Format: | Thesis Book |
| Language: | English |
| Published: |
2005.
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| LEADER | 00987cam a2200241 a 4500 | ||
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| 001 | u707269 | ||
| 003 | SIRSI | ||
| 008 | 050609s2005 my t 000 0 eng m | ||
| 040 | |a UMJ |d UMM | ||
| 090 | |a TJ7 |b UM 2005 Won | ||
| 097 | |a TJ7 |b UM 2005 Won | ||
| 100 | 1 | 0 | |a Wong, Poh Ling |
| 245 | 1 | 2 | |a A reliability methodology for deep sub-micron interconnect metal liners / |c Wong Poh Ling. |
| 260 | |c 2005. | ||
| 300 | |a xii, 114 leaves : |b ill, ; |c 28 cm. | ||
| 502 | |a Dissertation (M.Eng.Sc.) -- Jabatan Kejuruteraan Mekanik, Fakulti Kejuruteraan, Universiti Malaya, 2005. | ||
| 504 | |a Bibliography: leaves 106-114. | ||
| 650 | 0 | |a Electrodiffusion. | |
| 650 | 0 | |a Copper |x Electric properties. | |
| 710 | |a Universiti Malaya. |b Jabatan Kejuruteraan Mekanik. | ||
| 596 | |a 1 7 | ||
| 999 | |a TJ7 UM 2005 WON |w LC |c 1 |i A511898638 |d 22/8/2006 |f 22/8/2006 |g 1 |l STACKS |m P01UTAMA |r Y |s Y |t TESIS |u 22/8/2006 | ||
| 999 | |a TJ7 UM 2005 WON |w LC |c 1 |i A512475851 |d 23/7/2008 |f 23/7/2008 |g 1 |l STACKS |m P07JURUTER |r Y |s Y |t TESIS |u 21/7/2008 | ||