A reliability methodology for deep sub-micron interconnect metal liners /
Saved in:
Main Author: | Wong, Poh Ling |
---|---|
Format: | Thesis Book |
Language: | English |
Published: |
2005.
|
Subjects: | |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Similar Items
-
Effect of electromigration on the lead-free solder joint with addition of porous copper interlayer /
by: Jannatun Adzura Adnan
Published: (2015) -
Electromigration damage in lead-free solder joints prepared using metallic nanoparticle doped flux /
by: Nasir, Muhammad
Published: (2017) -
Effect of heating on bonding characteristics for copper wire bond technology /
by: Gurbinder Singh Gurmukh Singh
Published: (2021) -
Microstructure and mechanical properties of porous copper and copper brazed with cu-based filler metal /
by: Sami, Mian Muhammad
Published: (2021) -
Mechanical and microstructure analysis of copper to copper foam brazing using copper-tin-nickel-phosphorus amorphous filler alloys /
by: Nur Amirah Mohd Zahri
Published: (2021)