Warpage and stress analysis of molded strip and stacked die quad flat no-lead package /
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| Main Author: | |
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| Format: | Thesis Book |
| Language: | English |
| Published: |
2005.
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| Subjects: | |
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| Physical Description: | xi, 102 leaves : ill. ; 28 cm. |
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| Bibliography: | Bibliography: leaves. 81-83. |