Warpage and stress analysis of molded strip and stacked die quad flat no-lead package /
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| Main Author: | |
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| Format: | Thesis Book |
| Language: | English |
| Published: |
2005.
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| Subjects: | |
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| LEADER | 01039cam a2200241 a 4500 | ||
|---|---|---|---|
| 001 | u707784 | ||
| 003 | SIRSI | ||
| 008 | 050614s2005 my t 000 0 eng m | ||
| 040 | |a UMJ |d UMM | ||
| 090 | |a TS176 |b UM 2005 Ng | ||
| 097 | |a TS176 |b UM 2005 Ng | ||
| 100 | 1 | 0 | |a Ng, Cheong Chiang. |
| 245 | 1 | 0 | |a Warpage and stress analysis of molded strip and stacked die quad flat no-lead package / |c Ng Cheong Chiang. |
| 260 | |c 2005. | ||
| 300 | |a xi, 102 leaves : |b ill. ; |c 28 cm. | ||
| 502 | |a Dissertation (M.Eng.) -- Jabatan Kejuruteraan Rekabentuk dan Pembuatan, Fakulti Kejuruteraan, Universiti Malaya, 2005. | ||
| 504 | |a Bibliography: leaves. 81-83. | ||
| 650 | 0 | |a Molding materials |x Testing. | |
| 710 | 2 | 0 | |a Universiti Malaya. |b Jabatan Kejuruteraan Rekabentuk dan Pembuatan. |
| 900 | |a SK | ||
| 596 | |a 1 7 | ||
| 999 | |a TS176 UM 2005 NG |w LC |c 1 |i A511898825 |d 29/4/2008 |e 29/4/2008 |f 22/8/2006 |g 1 |l STACKS |m P01UTAMA |n 1 |r Y |s Y |t TESIS |u 22/8/2006 | ||
| 999 | |a TS176 UM 2005 NG |w LC |c 1 |i A512475815 |d 23/7/2008 |f 23/7/2008 |g 1 |l STACKS |m P07JURUTER |r Y |s Y |t TESIS |u 21/7/2008 | ||