The effect of microstructural properties of bonding wires on performance of wirebond interconnect /
محفوظ في:
| المؤلف الرئيسي: | |
|---|---|
| التنسيق: | أطروحة كتاب |
| اللغة: | English |
| منشور في: |
2005.
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| الموضوعات: | |
| الوسوم: |
إضافة وسم
لا توجد وسوم, كن أول من يضع وسما على هذه التسجيلة!
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| LEADER | 00909cam a2200241 a 4500 | ||
|---|---|---|---|
| 001 | u725628 | ||
| 003 | SIRSI | ||
| 005 | 200608071110 | ||
| 008 | 060807s2005 my t 000 0 eng m | ||
| 040 | |a UMM | ||
| 090 | |a QC3 |b UMP 2005 Ghao | ||
| 100 | 0 | 0 | |a Ghazali Omar |
| 245 | 1 | 4 | |a The effect of microstructural properties of bonding wires on performance of wirebond interconnect / |c Ghazali Omar. |
| 260 | |c 2005. | ||
| 300 | |a xvi, 216 leaves : |b ill. ; |c 30 cm. | ||
| 500 | |a Supervised by Prof. Dr. Muhamad Rasat ibin Muhamad. | ||
| 502 | |a Thesis (Ph.D.) -- Jabatan Fizik, Fakulti Sains, Universiti Malaya, 2005. | ||
| 504 | |a Bibliography: leaves 210-216. | ||
| 650 | 0 | |a Microstructure. | |
| 650 | 0 | |a Wire bonding (Electronic packaging) | |
| 710 | 2 | 0 | |a Universiti Malaya. |b Jabatan Fizik. |
| 596 | |a 1 | ||
| 999 | |a QC3 UMP 2005 GHAO |w LC |c 1 |i A511940340 |d 25/8/2006 |f 25/8/2006 |g 1 |l STACKS |m P01UTAMA |r Y |s Y |t TESIS |u 23/8/2006 | ||