A study of stress in backend metallization in ULSI devices /
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| Main Author: | |
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| Format: | Thesis Book |
| Language: | English |
| Published: |
2006.
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| LEADER | 00937cam a2200253 a 4500 | ||
|---|---|---|---|
| 001 | u736613 | ||
| 003 | SIRSI | ||
| 005 | 200704111143 | ||
| 008 | 070411s2006 my a t 000 0 eng m | ||
| 040 | |a UMM |d UMJ | ||
| 090 | |a TJ7 |b UM 2006 Goh | ||
| 097 | |a TJ7 |b UM 2006 Goh | ||
| 100 | 1 | |a Goh, Chia Lan. | |
| 245 | 1 | 2 | |a A study of stress in backend metallization in ULSI devices / |c Goh Chia Lan. |
| 260 | |c 2006. | ||
| 300 | |a xvii, 75 leaves : |b ill. ; |c 30 cm. | ||
| 502 | |a Dissertation (M.Eng.) -- Jabatan Kejuruteraan Mekanik, Fakulti Kejuruteraan, Universiti Malaya, 2006. | ||
| 504 | |a Bibliography: leaves 72-75. | ||
| 650 | 0 | |a Integrated circuits |x Ultra large scale integration. | |
| 650 | 0 | |a Strains and stresses. | |
| 710 | 2 | |a Universiti Malaya. |b Jabatan Kejuruteraan Mekanik. | |
| 900 | |a HF | ||
| 596 | |a 1 | ||
| 999 | |a TJ7 UM 2006 GOH |w LC |c 1 |i A512621746 |d 19/1/2011 |e 19/1/2011 |f 26/11/2007 |g 1 |l STACKS |m P01UTAMA |n 2 |r Y |s Y |t TESIS |u 26/11/2007 | ||