Design and materials for microelectronic package-improvement of interfacial adhesion in plastic packages /
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| Main Author: | |
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| Format: | Thesis Book |
| Language: | English |
| Published: |
2007.
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| Subjects: | |
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| LEADER | 00864cam a2200241 a 4500 | ||
|---|---|---|---|
| 001 | u764661 | ||
| 003 | SIRSI | ||
| 005 | 200901291231 | ||
| 008 | 090129s2007 my t 000 0 eng m | ||
| 040 | |a UMM | ||
| 090 | |a QC3 |b UM 2007 Shu | ||
| 100 | 0 | |a Shutesh Krishnan. | |
| 245 | 1 | 0 | |a Design and materials for microelectronic package-improvement of interfacial adhesion in plastic packages / |c Shutesh Krishnan. |
| 260 | |c 2007. | ||
| 300 | |a xx, 156 leaves : |b ill. ; |c 30 cm. | ||
| 502 | |a Dissertation (M.Sc.) -- Jabatan Fizik, Fakulti Sains, Universiti Malaya, 2008. | ||
| 504 | |a Bibliography: leaves 151-156. | ||
| 650 | 0 | |a Microelectronic packaging. | |
| 650 | 0 | |a Packaging. | |
| 710 | 2 | |a Universiti Malaya. |b Jabatan Fizik. | |
| 900 | |a ZSA | ||
| 596 | |a 1 | ||
| 999 | |a QC3 UM 2007 SHU |w LC |c 1 |i A513444845 |d 7/10/2009 |f 7/10/2009 |g 1 |l STACKS |m P01UTAMA |r Y |s Y |t TESIS |u 2/10/2009 | ||