APA引文

Angellia, L. D. (2009). The effect of copper powder addition on spreading characteristics and mechanical behaviour of Sn-Ag-Cu solder.

Chicago Style (17th ed.) Citation

Angellia, Lian Dewi. The Effect of Copper Powder Addition on Spreading Characteristics and Mechanical Behaviour of Sn-Ag-Cu Solder. 2009.

MLA引文

Angellia, Lian Dewi. The Effect of Copper Powder Addition on Spreading Characteristics and Mechanical Behaviour of Sn-Ag-Cu Solder. 2009.

警告：這些引文格式不一定是100％准確.