The effect of copper powder addition on spreading characteristics and mechanical behaviour of Sn-Ag-Cu solder /

The effect of copper powder addition on spreading characteristics and mechanical behaviour of Sn-Ag-Cu solder /

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書目詳細資料
主要作者:	Angellia, Lian Dewi
格式:	Thesis 圖書
語言:	English
出版:	2009.
主題:	Copper powder. Solder and soldering. Microstructure.
標簽:	添加標簽沒有標簽, 成為第一個標記此記錄!

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