The effect of copper powder addition on spreading characteristics and mechanical behaviour of Sn-Ag-Cu solder /

The effect of copper powder addition on spreading characteristics and mechanical behaviour of Sn-Ag-Cu solder /

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书目详细资料
主要作者:	Angellia, Lian Dewi
格式:	Thesis 图书
语言:	English
出版:	2009.
主题:	Copper powder. Solder and soldering. Microstructure.
标签:	添加标签没有标签, 成为第一个标记此记录!

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