Effect of Cu addition on the conductivity of xCuI-(1-x)Agl, (0.1< [symbol < with a line under it] x< [symbol < with a line under it] 0.4) solid solutions /
محفوظ في:
| المؤلف الرئيسي: | |
|---|---|
| التنسيق: | أطروحة كتاب |
| اللغة: | English |
| منشور في: |
2010.
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| الموضوعات: | |
| الوصول للمادة أونلاين: | http://studentsrepo.um.edu.my/id/eprint/6228 |
| الوسوم: |
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| 008 | 100907s2010 my a t 000 0 eng m | ||
| 040 | |a UMM |d AUM | ||
| 090 | |a QC3 |b UM 2010 Chu | ||
| 100 | 0 | |a Chu, Lee Peng. | |
| 245 | 1 | 0 | |a Effect of Cu addition on the conductivity of xCuI-(1-x)Agl, (0.1< [symbol < with a line under it] x< [symbol < with a line under it] 0.4) solid solutions / |c Chu Lee Peng. |
| 260 | |c 2010. | ||
| 300 | |a xiv, 140 leaves : |b ill. ; |c 30 cm | ||
| 500 | |a On t.p. "< with a line under it" is symbol meaning "less than or equal to". | ||
| 502 | |a Dissertation (M.Sc.) -- Jabatan Fizik, Fakukti Sains, Universiti Malaya, 2010. | ||
| 504 | |a Bibliography: leaves 132-140. | ||
| 530 | |a Also issued in CD. | ||
| 650 | 0 | |a Cuprous iodide |x Thermal properties. | |
| 650 | 0 | |a Ionic crystals |x Thermal properties. | |
| 650 | 0 | |a Silver iodide. | |
| 650 | 0 | |a Copper |x Thermal conductivity. | |
| 650 | 0 | |a Silver |x Thermal conductivity. | |
| 650 | 0 | |a Solutions, Solid. | |
| 710 | 2 | |a Universiti Malaya. |b Jabatan Fizik. | |
| 856 | 4 | 1 | |u http://studentsrepo.um.edu.my/id/eprint/6228 |
| 900 | |a NAR-ZA | ||
| 596 | |a 1 25 | ||
| 999 | |a QC3 UM 2010 CHU |w LC |c 1 |i A510508775 |d 17/3/2011 |f 17/3/2011 |g 1 |l STACKS |m P01UTAMA |r Y |s Y |t TESIS |u 16/3/2011 | ||
| 999 | |a QC3 UM 2010 CHU |w LC |c 1 |i A514485002 |l STACKS |m P25UMARCHI |r Y |s Y |t CD |u 28/3/2017 |1 STEM |2 GIFT | ||