Effects of nickel and cobalt nanoparticle additions to Sn-Ag-Cu solder /
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Main Author: | |
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Format: | Thesis Book |
Language: | English |
Published: |
2011.
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LEADER | 01157cam a2200301 a 4500 | ||
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001 | u831181 | ||
003 | SIRSI | ||
005 | 201106131453 | ||
008 | 110613s2011 my a t 00 0 eng m | ||
040 | |a UMM |u MJ | ||
090 | |a TJ7 |b UM 2011 Tay | ||
097 | |a TJ7 |b UM 2011 Tay | ||
100 | 1 | |a Tay, See Leng | |
245 | 1 | 0 | |a Effects of nickel and cobalt nanoparticle additions to Sn-Ag-Cu solder / |c Tay See Leng. |
260 | |c 2011. | ||
300 | |a xviii, 116 leaves : |b ill.; |c 30cm. | ||
502 | |a Dissertation (M.Eng.Sc.) -- Jabatan Kejuruteraan Mekanik, Fakulti Kejuruteraan, Universiti Malaya, 2011. | ||
504 | |a Bibliography: leaves 103-114. | ||
650 | 0 | |a Electronic packaging |x Materials. | |
650 | 0 | |a Solder and soldering |x Materials. | |
650 | 0 | |a Nanocomposites (Materials). | |
650 | 0 | |a Cobalt. | |
650 | 0 | |a Nickel. | |
710 | 2 | |a Universiti Malaya. |b Jabatan Kejuruteraan Mekanik. | |
900 | |a NHS | ||
596 | |a 1 7 | ||
999 | |a TJ7 UM 2011 TAY |w LC |c 1 |i A514716770 |d 30/4/2015 |e 30/4/2015 |f 19/7/2011 |g 1 |l STACKS |m P01UTAMA |n 7 |r Y |s Y |t TESIS |u 19/7/2011 | ||
999 | |a TJ7 UM 2011 TAY |w LC |c 1 |i A514908735 |d 13/2/2012 |f 13/2/2012 |g 1 |l STACKS |m P07JURUTER |r N |s Y |t TESIS |u 30/1/2012 |