Investigation of mechanical properties of paper-based packaging materials /

Investigation of mechanical properties of paper-based packaging materials /

Saved in:

书目详细资料
主要作者:	Masni-Azian Akiah
格式:	Thesis 图书
语言:	English
出版:	2011.
主题:	Paper > Packaging > Materials. Food > Packaging > Materials. Packaging > Materials.
标签:	添加标签没有标签, 成为第一个标记此记录!

相似书籍

Active paper coating based on fish gelatin, palm wax and lemongrass essential oil for ground beef packaging application
由: Sahid, Nurul Syahida
出版: (2020)

Study of alternative packaging materials for semiconductor devices /
由: Suprammaniam, Sugumar
出版: (1997)

Study on mold compound conversion from glob material for semiconductor ball grid array packaging /
由: Prakash Babu Balakrishnan
出版: (2012)

Production of high quality packaging paper from bamboo asam pulp with cellulose nanocrystals
由: Moradbak, Amin
出版: (2016)

A study of wire sweep during transfer molding on plastic IC packaging /
由: Wu, Jianhua
出版: (1996)

Potential of local k-carrageenan extracted from red seaweed (Eucheuma cottonii) as food packaging material
由: Abdul Muttalib, Ili Balqis
出版: (2018)

Design and materials for microelectronic package-improvement of interfacial adhesion in plastic packages /
由: Shutesh Krishnan
出版: (2007)

Development of biodegradable protein-based films incorporated with mango kernal extract for active packaging of mayonnaise
由: Zainal Arifin, Maryam 'Adilah
出版: (2018)

Susceptor Packaging Material For Baking Flaky Pastry Dough In Microwave Oven
由: Main, Nor Mazlana
出版: (2008)

Package cracking mechanism in plastic encapsulated integrated circuit devices /
由: Tan, Geok Leong
出版: (1993)

Mechanical, physical, antimicrobial and feasibility study of PLA-based nano bio-plastic for fruit packaging / Nik Syazwani Nik Ahmad
由: Nik Ahmad, Nik Syazwani
出版: (2023)

Material characterization of soft solder die attaches for power ICs /
由: Wee, Seng Kee
出版: (1996)

The effects of annealing, temperature and humidity on tin whiskers formation /
由: Lee, Hua Xing
出版: (2009)

Curing characterization of pressureless sintered die attach material as leadfree salution in microelectronics packaging /
由: Low, Pui Leng
出版: (2020)

Delamination propagation in plastic IC packages during solder reflow /
由: Ma, Yiyi
出版: (1999)

Study of compression behaviour and mechanical properties of paper pulp packaging using FEA /
由: Munirati Ahmad
出版: (2012)

Effects of electromagnetic fields and packaging shape on physicochemical and microbiological characteristics of water
由: Abdelrazik Abdelsamie , Maher Abdelaleem
出版: (2015)

Potential of gelatin films with silver-kaolin and cinnamon bark oil as primary packaging for packed salad
由: Idrus Saaidy, Nur Amila Najwa
出版: (2021)

Optimization and reliability of wirebond looping profile for broken neck failure /
由: Teoh, Cheng Lock
出版: (2012)

Fabrication and characterization of polylactic acid (PLA) film filled cinnamon/ZnO nanocomposite for fruit packaging / Nur Syazwani Abdul Malek
由: Abdul Malek, Nur Syazwani
出版: (2022)

Recent advances of different types of biopolymer as coating materials in food packaging : A review / Adilah Mohd Rushdi
由: Mohd Rushdi, Adilah Mohd Rushdi
出版: (2022)

Study of improvement in wire bonding process through critical parameters analysis /
由: Ong, Siew Kee
出版: (2011)

A research on packaging on product: Candlenuts by Nadia / Nur Syahira Idris
由: Idris, Nur Syahira
出版: (2022)

Effects of nickel and cobalt nanoparticle additions to Sn-Ag-Cu solder /
由: Tay, See Leng
出版: (2011)

The impact of infused health drinks packaging design on consumer / Nur Shakirah Mohd Shukri
由: Mohd Shukri, Nur Shakirah
出版: (2015)

Development of expanded polystyrene cushion design guidelines for reliable flat-screen television packaging
由: Kassim, Normah
出版: (2020)

Packaging design as a marketing tool in promoting Tapai Pulut Sarimah / Nurdalila Meor Sepli
由: Meor Sepli, Nurdalila
出版: (2017)

The design issue of local SME food and beverage product labelling and packaging: designers versus audience perspectives / Wan Alia Najiha Wan Mahmud
由: Wan Mahmud, Wan Alia Najiha
出版: (2022)

Preparation and characterization of copper/copper-coated silicon carbide composites for electronic packaging /
由: Azida Azmi
出版: (2012)

Effect of Libyan marinade and vaccum packaging on quality parameters of Tilapia (Oreochromus niloticus) and Yellowstripe scad (Selaroides leptolepis) fillets during storage /
由: Shakhtour, Fathia G. Moh

A study of wire bonded Cu-A1 in microelectronics packaging /
由: Tan, Chee Wei
出版: (2002)

Structural analysis of flexible packaging industry in Malaysia /
由: Lim, Bee Leong
出版: (1995)

First bonding parameter optimization in wire bonding process /
由: Syila Izawana Ismail

Study of the effect of process variation on wire bond process of IC assembly /
由: Intan Mastura Saadon
出版: (2012)

Applications of pullulan active packaging incorporated with green synthesized curcumin (C-AgNPs) and pullulan (P-AgNPs) mediated silver nanoparticles on quality of broiler meat
由: Muhammad, Jamshed
出版: (2021)

Colour versus flavour in the choice of bread packaging design among children at Taman Asuhan & Didikan Kanak-Kanak University Malaya (TADIKUM) Kuala Lumpur /
由: Revathi Aruchunan
出版: (2019)

Effects of maturity stages at harvest, packaging materials and storage duration on physico-chemical characteristics of lemongrass (cymbopogon citratus stapf)
由: Tajidin, Nor Elliza
出版: (2012)

An illustration approach characteristic of Malaysian culture through food packaging case study: Uncang Tea / Siti Sarah Amanina Rosli
由: Rosli, Siti Sarah Amanina
出版: (2022)

Comparison of performance of no-clean and water-soluble fluxes in fine-pitch flip-chip package /
由: Wakeel, Saif
出版: (2021)

Investigation of the quality and reliability of copper interconnects /
由: Koh, Leong Tee
出版: (2000)

Services hosted by the Perpustakaan Sultan Abdul Samad, Universiti Putra Malaysia with Cooperation MySyL Group