The effect of copper particle addition into Sn-3.5Ag solder /

Saved in:
Bibliographic Details
Main Author: Aemi Nadia Ahmad Sauffi
Format: Thesis Book
Language:English
Published: 2011.
Subjects:
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Physical Description:xvii, 100 leaves : ill. ; 30 cm.
Bibliography:Bibliography: leaves 92-99.