Optimization of gel dispensing process in pressure sensor assembly /
محفوظ في:
| المؤلف الرئيسي: | |
|---|---|
| التنسيق: | أطروحة كتاب |
| اللغة: | English |
| منشور في: |
2010.
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| الموضوعات: | |
| الوسوم: |
إضافة وسم
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| LEADER | 01201cam a2200277 a 4500 | ||
|---|---|---|---|
| 001 | u853020 | ||
| 003 | SIRSI | ||
| 005 | 201203131256 | ||
| 008 | 120313s2010 my a t 000 0 eng m | ||
| 040 | |a UMM |d UMJ | ||
| 090 | |a TS176 |b UM 2010 Shunmr | ||
| 097 | |a TS176 |b UM 2010 Shunmr | ||
| 100 | 0 | |a Shukri Nizam Mohamed Radzi. | |
| 245 | 1 | 0 | |a Optimization of gel dispensing process in pressure sensor assembly / |c Shukri Nizam Mohamed Radzi. |
| 260 | |c 2010. | ||
| 300 | |a xiii, 92 leaves : |b ill. ; |c 30 cm. | ||
| 502 | |a Dissertation (M.Eng. (Manuf.)) -- Jabatan Kejuruteraan Rekabentuk dan Pembuatan, Fakulti Kejuruteraan, Universiti Malaya, 2010. | ||
| 504 | |a Bibliography: leaves 90-92. | ||
| 650 | 0 | |a Microelectromechanical systems |x Design and construction. | |
| 650 | 0 | |a Microencapsulation. | |
| 650 | 0 | |a Wire bonding (Electronic packaging). | |
| 710 | 2 | |a Universiti Malaya. |b Jabatan Kejuruteraan Rekabentuk dan Pembuatan. | |
| 900 | |a NHS-ZA | ||
| 596 | |a 7 | ||
| 999 | |a TS176 UM 2010 SHUNMR |w LC |c 1 |i A513413110 |d 18/12/2012 |f 18/12/2012 |g 1 |l STACKS |m P07JURUTER |r N |s Y |t TESIS |u 17/12/2012 | ||
| 999 | |a TS176 UM 2010 SHUNMR |w LC |c 2 |i A513412264 |d 8/4/2014 |f 8/4/2014 |g 1 |l STACKS |m P07JURUTER |r N |s Y |t TESIS |u 2/4/2014 | ||
