Performance of Ni-W alloys as barrier film between lead free solder and copper substrate /
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| Main Author: | |
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| Format: | Thesis Book |
| Language: | English |
| Published: |
2011.
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| Subjects: | |
| Online Access: | http://studentsrepo.um.edu.my/id/eprint/8014 |
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| Physical Description: | xv, 91 [2] leaves : ill. ; 30 cm. |
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| Bibliography: | Bibliography: leaves 77-84. |