Effects of molybdenum nanoparticles on lead-free tin-based solder /
Saved in:
Main Author: | Mahmood, Md. Arafat (Author) |
---|---|
Format: | Thesis Book |
Language: | English |
Subjects: | |
Online Access: | http://studentsrepo.um.edu.my/id/eprint/8373 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Similar Items
-
Effects of molybdenum nanoparticles on the interface between lead-free solder and nickel substrate /
by: Mahdavifard, Mohammad Hossein
Published: (2013) -
The electrical properties of element-added (FE, AL) lead-free solder alloys : experimental and materials modeling approaches /
by: Nur'aishah Aminah Mohd Amin
Published: (2015) -
Electrodeposition and characterization of SN-BI lead-free soldier alloys /
by: Goh, Ying Xin
Published: (2015) -
Performance of Ni-W alloys as barrier film between lead free solder and copper substrate /
by: Chew, Chee Sean
Published: (2011) -
Development of Lead-Free Sn-0.7Cu-Si3N4 composite solders
by: Muhammad Hafiz, Zan @ Hazizi