Study of the effect of process variation on wire bond process of IC assembly /

Study of the effect of process variation on wire bond process of IC assembly /

Saved in:
书目详细资料
主要作者: Intan Mastura Saadon
格式: Thesis 图书
语言:English
出版: 2012.
主题:
Wire bonding (Electronic packaging).
Electronic packaging > Reliability.
Electronic packaging > Defects.
Semiconductors > Failures.
标签: 添加标签
没有标签, 成为第一个标记此记录!
实物特征
实物描述:xiii, 68 leaves : ill. ; 30 cm.
参考书目:Bibliography: leaves 67-68.

相似书籍