First bonding parameter optimization in wire bonding process /
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| Format: | Thesis Book |
| Language: | English |
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| LEADER | 01365cam a2200325 i 4500 | ||
|---|---|---|---|
| 001 | u865777 | ||
| 003 | SIRSI | ||
| 005 | 201210021006 | ||
| 008 | 121002s2012 my a t 000 0 eng m | ||
| 040 | |a UMM |d UMJ |e rda | ||
| 090 | |a TK7 |b UM 2012 Syiii | ||
| 097 | |a TK7 |b UM 2012 Syiii | ||
| 100 | 0 | |a Syila Izawana Ismail, |e author. | |
| 245 | 1 | 0 | |a First bonding parameter optimization in wire bonding process / |c Syila Izawana binti Ismail. |
| 264 | 1 | |c 2012. | |
| 264 | 4 | |c 2012. | |
| 300 | |a xiii, 55 [31] leaves : |b illustrations ; |c 30 cm. | ||
| 336 | |a text |2 rdacontent | ||
| 337 | |a unmediated |2 rdamedia | ||
| 338 | |a volume |2 rdacarrier | ||
| 502 | |b M.Eng. |c Jabatan Kejuruteraan Elektrik, Fakulti Kejuruteraan, Universiti Malaya |d 2012. | ||
| 504 | |a Bibliography: leaves 54-55. | ||
| 596 | |a 1 7 | ||
| 650 | 0 | |a Wire bonding (Electronic packaging) | |
| 650 | 0 | |a Electronic packaging |x Reliability. | |
| 710 | 2 | 0 | |a Universiti Malaya. |b Jabatan Kejuruteraan Elektrik, |e degree granting institution. |
| 900 | |a AT-ZA | ||
| 999 | |a TK7 UM 2012 SYIII |w LC |c 1 |i A515293729 |d 7/11/2013 |f 7/11/2013 |g 1 |l STACKS |m P01UTAMA |r Y |s Y |t TESIS |u 6/11/2013 | ||
| 999 | |a TK7 UM 2012 SYIII |w LC |c 1 |i A516158005 |d 24/3/2015 |f 24/3/2015 |g 1 |l STACKS |m P07JURUTER |r N |s Y |t TESIS |u 24/3/2015 | ||
| 999 | |a TK7 UM 2012 SYIII |w LC |c 2 |i A516158019 |d 24/3/2015 |f 24/3/2015 |g 1 |l COUNTER |m P07JURUTER |r N |s Y |t CD |u 24/3/2015 | ||