Optimization and reliability of wirebond looping profile for broken neck failure /

محفوظ في:

التفاصيل البيبلوغرافية
المؤلف الرئيسي:	Teoh, Cheng Lock
التنسيق:	أطروحة كتاب
اللغة:	English
منشور في:	2012.
الموضوعات:	Wire bonding (Electronic packaging) > Production control. Electronic packaging > Reliability.
الوسوم:	إضافة وسم لا توجد وسوم, كن أول من يضع وسما على هذه التسجيلة!

مواد مشابهة

First bonding parameter optimization in wire bonding process /
بواسطة: Syila Izawana Ismail

Study of improvement in wire bonding process through critical parameters analysis /
بواسطة: Ong, Siew Kee
منشور في: (2011)

The effect of microstructural properties of bonding wires on performance of wirebond interconnect /
بواسطة: Ghazali Omar
منشور في: (2005)

Study of the effect of process variation on wire bond process of IC assembly /
بواسطة: Intan Mastura Saadon
منشور في: (2012)

Optimization of gel dispensing process in pressure sensor assembly /
بواسطة: Shukri Nizam Mohamed Radzi
منشور في: (2010)

Effect of free air ball (FAB) formation on wire bond integrity in palladium coated copper (PdCu) wire /
بواسطة: Mohd Firdaus Manap
منشور في: (2017)

An Expert System for Trouble Shooting - Auto Wire Bonder Machine
بواسطة: Ng, Yu Ting
منشور في: (1997)

Pengoptimuman keadaan perlekatan dai dan perlekatan bebola termosonik terhadap prestasi pakej dai bertingkat 3D QFN /
بواسطة: Mohamad Firdaus Rosle
منشور في: (2010)

Investigation of mechanical properties of paper-based packaging materials /
بواسطة: Masni-Azian Akiah
منشور في: (2011)

Thermal-mechanical analysis of bonding pad in insulated gate bipolar transistor

Kesan kombinasi arus elektrik dan daya lekatan bagi proses lekatan wayar termosonik pakej dai bertingkat 3D quad flat nolead (QFN) /
بواسطة: Saidatul Azura Radzi
منشور في: (2011)

Investigation of the quality and reliability of copper interconnects /
بواسطة: Koh, Leong Tee
منشور في: (2000)

Delamination propagation in plastic IC packages during solder reflow /
بواسطة: Ma, Yiyi
منشور في: (1999)

A study of wire sweep during transfer molding on plastic IC packaging /
بواسطة: Wu, Jianhua
منشور في: (1996)

Study on mold compound conversion from glob material for semiconductor ball grid array packaging /
بواسطة: Prakash Babu Balakrishnan
منشور في: (2012)

Wearout reliability studies of bonding wires used in nano electronic device packaging
بواسطة: Gan, Chong Leong

The effects of annealing, temperature and humidity on tin whiskers formation /
بواسطة: Lee, Hua Xing
منشور في: (2009)

Design and materials for microelectronic package-improvement of interfacial adhesion in plastic packages /
بواسطة: Shutesh Krishnan
منشور في: (2007)

Susceptor Packaging Material For Baking Flaky Pastry Dough In Microwave Oven
بواسطة: Main, Nor Mazlana
منشور في: (2008)

Development of expanded polystyrene cushion design guidelines for reliable flat-screen television packaging
بواسطة: Kassim, Normah
منشور في: (2020)

Mechanical, physical, antimicrobial and feasibility study of PLA-based nano bio-plastic for fruit packaging / Nik Syazwani Nik Ahmad
بواسطة: Nik Ahmad, Nik Syazwani
منشور في: (2023)

Package cracking mechanism in plastic encapsulated integrated circuit devices /
بواسطة: Tan, Geok Leong
منشور في: (1993)

Development of biodegradable protein-based films incorporated with mango kernal extract for active packaging of mayonnaise
بواسطة: Zainal Arifin, Maryam 'Adilah
منشور في: (2018)

Camera Independent Face Recognition Algorithm In Visual Surveillance
بواسطة: Yew, Chuu Tian
منشور في: (2015)

Highly Efficient Multi-Gigabit Commandstatus Packet Tunneling Technique In Inter-Fpga Packet Streaming Architecture
بواسطة: Loh, Mui Soon
منشور في: (2016)

Real-Time Capable Multi-Hop Media Access Control Protocol For Smart Home Environment
بواسطة: M.Shukeri, Nurulfaizal
منشور في: (2017)

A study of curing process optimisation for manufacturing of polyurethane enamelled copper wire /
بواسطة: Sim, Weng Kee
منشور في: (2009)

Study of compression behaviour and mechanical properties of paper pulp packaging using FEA /
بواسطة: Munirati Ahmad
منشور في: (2012)

Study of alternative packaging materials for semiconductor devices /
بواسطة: Suprammaniam, Sugumar
منشور في: (1997)

Fabrication and characterization of polylactic acid (PLA) film filled cinnamon/ZnO nanocomposite for fruit packaging / Nur Syazwani Abdul Malek
بواسطة: Abdul Malek, Nur Syazwani
منشور في: (2022)

Implementation of reliability centered maintenance for productivity enhancement : a case study in a tyre manufacturing company /
بواسطة: Hema Vinodrai
منشور في: (2011)

Active paper coating based on fish gelatin, palm wax and lemongrass essential oil for ground beef packaging application
بواسطة: Sahid, Nurul Syahida
منشور في: (2020)

Validation of Colpitts Vco Design for Two Way Portable Radio Applications
بواسطة: Raj Arul, Aldrin
منشور في: (2013)

Improving the Efficiency of Histogram of Oriented Gradient Feature for Human Detection
بواسطة: Lai, Chi Qin
منشور في: (2016)

Improvement of Underwater Image Contrast Enhancement Technique Based on Histogram Modification
بواسطة: Abdul Ghani, Ahmad Shahrizan
منشور في: (2015)

Crash Recovery Support For Variable Strength T-Way Test Generation Strategy
بواسطة: Abdullah, Syahrul Afzal Che
منشور في: (2016)

The impact of infused health drinks packaging design on consumer / Nur Shakirah Mohd Shukri
بواسطة: Mohd Shukri, Nur Shakirah
منشور في: (2015)

The effectiveness of colour used in branding KIP Mart Hypermarket / Siti Nurfarahin Hasan
بواسطة: Hasan, Siti Nurfarahin
منشور في: (2015)

Packaging design as a marketing tool in promoting Tapai Pulut Sarimah / Nurdalila Meor Sepli
بواسطة: Meor Sepli, Nurdalila
منشور في: (2017)

The design issue of local SME food and beverage product labelling and packaging: designers versus audience perspectives / Wan Alia Najiha Wan Mahmud
بواسطة: Wan Mahmud, Wan Alia Najiha
منشور في: (2022)

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