Study on mold compound conversion from glob material for semiconductor ball grid array packaging /

Study on mold compound conversion from glob material for semiconductor ball grid array packaging /

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書目詳細資料
主要作者:	Prakash Babu Balakrishnan
格式:	Thesis 圖書
語言:	English
出版:	2012.
主題:	Semiconductors > Materials > Testing. Electronic packaging > Materials.
標簽:	添加標簽沒有標簽, 成為第一個標記此記錄!

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