Kam, C. W. K. (2013). Integrated circuit package chipping methodology improvement by using DMAIC.
Chicago Style (17th ed.) CitationKam, Crispian Weng Kit. Integrated Circuit Package Chipping Methodology Improvement by Using DMAIC. 2013.
MLA (8th ed.) CitationKam, Crispian Weng Kit. Integrated Circuit Package Chipping Methodology Improvement by Using DMAIC. 2013.
Warning: These citations may not always be 100% accurate.