APA引文

Kam, C. W. K. (2013). Integrated circuit package chipping methodology improvement by using DMAIC.

Chicago Style (17th ed.) Citation

Kam, Crispian Weng Kit. Integrated Circuit Package Chipping Methodology Improvement by Using DMAIC. 2013.

MLA引文

Kam, Crispian Weng Kit. Integrated Circuit Package Chipping Methodology Improvement by Using DMAIC. 2013.

警告：這些引文格式不一定是100％准確.