Solderability of Sn-Cu-based lead-free solder with low content of silver and indium /
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| Main Author: | |
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| Format: | Thesis Book |
| Language: | English |
| Subjects: | |
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| Physical Description: | xix, 116 leaves, 13 unnumbered leaves : illustrations ; 30 cm |
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| Bibliography: | Bibliography: leaves 109-114 |