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Study of the effect of process variation on wire bond process of IC assembly /
by
Intan Mastura Saadon
Published 2012
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Investigation of the quality and reliability of copper interconnects /
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Koh, Leong Tee
Published 2000
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The effects of annealing, temperature and humidity on tin whiskers formation /
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Lee, Hua Xing
Published 2009
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Study on mold compound conversion from glob material for semiconductor ball grid array packaging /
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Prakash Babu Balakrishnan
Published 2012
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Institution
Universiti Malaya
4
Collection
Catalog
4
Author
Intan Mastura Saadon
1
Koh, Leong Tee
1
Lee, Hua Xing
1
Prakash Babu Balakrishnan
1
Granting Institution
Universiti Malaya.
3
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Services hosted by the Perpustakaan Sultan Abdul Samad, Universiti Putra Malaysia with Cooperation MySyL Group
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