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  1. 1
    Curing characterization of pressureless sintered die attach material as leadfree salution in microelectronics packaging /
    by Low, Pui Leng
    Published 2020
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    Thesis Book
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  2. 2
    Material characterization of soft solder die attaches for power ICs /
    by Wee, Seng Kee
    Published 1996
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  3. 3
    A study of wire sweep during transfer molding on plastic IC packaging /
    by Wu, Jianhua
    Published 1996
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  4. 4
    Study of alternative packaging materials for semiconductor devices /
    by Suprammaniam, Sugumar
    Published 1997
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