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Curing characterization of pressureless sintered die attach material as leadfree salution in microelectronics packaging /
by
Low, Pui Leng
Published 2020
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Material characterization of soft solder die attaches for power ICs /
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Wee, Seng Kee
Published 1996
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A study of wire sweep during transfer molding on plastic IC packaging /
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Wu, Jianhua
Published 1996
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Study of alternative packaging materials for semiconductor devices /
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Suprammaniam, Sugumar
Published 1997
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Institution
Universiti Malaya
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Catalog
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Author
Low, Pui Leng
1
Suprammaniam, Sugumar
1
Wee, Seng Kee
1
Wu, Jianhua
1
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Universiti Malaya.
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