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Ball grid array technology
Dissertations
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Dissertations, Academic
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Electronic packaging
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Flip chip technology
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Lead-free electronics manufacturing processes
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Microelectronic packaging
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Solder and soldering
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Penyelesaian kegagalan pada isian bawah dalam pakej cip balikan tatasusun grid bebola (FC-BGA) /
by
Zainudin Kornain
Published 2012
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Keboleharapan penyambung bahan pateri bebas plumbum menggunakan kaedah ujian penarik bebola di dalam pakej semikonduktor /
by
Muhammad Najib Harif
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Improvement on the ball attach process of BGA packages /
by
Thiaga Rajan Muthusamy
Published 1999
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Institution
Universiti Kebangsaan Malaysia
2
Universiti Malaya
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Collection
Catalog
3
Author
Muhammad Najib Harif
1
Thiaga Rajan Muthusamy
1
Zainudin Kornain
1
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Universiti Malaya.
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