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  1. 1
    Reliability of wire bonding in micro electronic packaging /
    by Ghazali Omar
    Published 1996
    Thesis Book
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  2. 2
    Sambungan termaju pengecilan pemasangan teknologi pelekatan permukaan melalui pes pateri berpenguat nano /
    Thesis Book
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  3. 3
    Finite element analysis of consecutive impacts on electronic devices and correlation to robustness /
    by Hua, Norman Shijie
    Published 2016
    Thesis Book
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