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  1. 1
    Curing characterization of pressureless sintered die attach material as leadfree salution in microelectronics packaging /
    由 Low, Pui Leng
    出版 2020
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  2. 2
    Comparison of pressure-assist silver sintering to tin silver solder alloy as die attach material in high power semiconductor /
    由 Tolentino, Erik Nino
    出版 2020
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  3. 3
    Package cracking mechanism in plastic encapsulated integrated circuit devices /
    由 Tan, Geok Leong
    出版 1993
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  4. 4
    Material characterization of soft solder die attaches for power ICs /
    由 Wee, Seng Kee
    出版 1996
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  5. 5
    A study of wire sweep during transfer molding on plastic IC packaging /
    由 Wu, Jianhua
    出版 1996
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  6. 6
    Development of non-post mold cure alternative for semiconductor packaging /
    由 Tan, Sook Wai
    出版 1997
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  7. 7
    Study of alternative packaging materials for semiconductor devices /
    由 Suprammaniam, Sugumar
    出版 1997
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  8. 8
    Development of high-temperature lead-free solder for semiconductor chip attachment /
    由 Haque, Ashraful
    出版 2011
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  9. 9
    A study of wire bonded Cu-A1 in microelectronics packaging /
    由 Tan, Chee Wei
    出版 2002
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  10. 10
    Kinetic growth of copper oxidation in semiconductor packaging /
    由 Siti Rahmah Esa
    出版 2017
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  11. 11
    Improvement on the ball attach process of BGA packages /
    由 Thiaga Rajan Muthusamy
    出版 1999
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  12. 12
    Design and materials for microelectronic package-improvement of interfacial adhesion in plastic packages /
    由 Shutesh Krishnan
    出版 2007
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