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  1. 1
    Material characterization of soft solder die attaches for power ICs /
    由 Wee, Seng Kee
    出版 1996
    主題: “...Microelectronic packaging. Materials....”
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  2. 2
    Study of alternative packaging materials for semiconductor devices /
    由 Suprammaniam, Sugumar
    出版 1997
    主題: “...Microelectronic packaging. Materials....”
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  3. 3
    Curing characterization of pressureless sintered die attach material as leadfree salution in microelectronics packaging /
    由 Low, Pui Leng
    出版 2020
    主題: “...Microelectronic packaging Materials....”
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