在您的搜寻 主题建议
Showing 1 - 5 results of 5 for search '"Plastics in packaging"', 查询时间: 0.01s Refine Results
  1. 1
    Package cracking mechanism in plastic encapsulated integrated circuit devices /
    由 Tan, Geok Leong
    出版 1993
    主题: “...Plastics in packaging Fracture....”
    Thesis 图书
    加到收藏夹
    Saved in:
  2. 2
    Delamination propagation in plastic IC packages during solder reflow /
    由 Ma, Yiyi
    出版 1999
    主题: “...Plastics in packaging Fracture...”
    Thesis 图书
    加到收藏夹
    Saved in:
  3. 3
    Study of alternative packaging materials for semiconductor devices /
    由 Suprammaniam, Sugumar
    出版 1997
    主题: “...Plastics in packaging....”
    Thesis 图书
    加到收藏夹
    Saved in:
  4. 4
    Hygrothermally-induced delamination and cracking in plastic IC packages /
    由 Lin, Tingyu
    出版 1999
    主题: “...Plastics in packaging Fracture...”
    Thesis 图书
    加到收藏夹
    Saved in:
  5. 5
    Colour versus flavour in the choice of bread packaging design among children at Taman Asuhan & Didikan Kanak-Kanak University Malaya (TADIKUM) Kuala Lumpur /
    由 Revathi Aruchunan
    出版 2019
    主题: “...Plastics in packaging Malaysia....”
    获取全文
    Thesis 图书
    加到收藏夹
    Saved in:
检索工具: 得到RSS订阅 — 推荐此搜索 — 保存搜索