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Showing 1 - 3 results of 3 for search '"Plastics in packaging Fracture"', query time: 0.03s Refine Results
  1. 1
    Package cracking mechanism in plastic encapsulated integrated circuit devices /
    by Tan, Geok Leong
    Published 1993
    Subjects: “...Plastics in packaging Fracture....”
    Thesis Book
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  2. 2
    Delamination propagation in plastic IC packages during solder reflow /
    by Ma, Yiyi
    Published 1999
    Subjects: “...Plastics in packaging Fracture...”
    Thesis Book
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  3. 3
    Hygrothermally-induced delamination and cracking in plastic IC packages /
    by Lin, Tingyu
    Published 1999
    Subjects: “...Plastics in packaging Fracture...”
    Thesis Book
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