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Showing 1 - 20 results of 49 for search '"Solder and soldering."', 查询时间: 0.02s Refine Results
  1. 1
    To obtain the optimum parameters for welding of copper and aluminum using friction welding technique / Mcdawson Dewk
    由 Dewk, Mcdawson
    出版 2010
    主题: “...Solder and soldering...”
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  2. 2
    Morphological and mechanical characterisation of BI-AG alloy as high temperature lead free solder
    由 Nahavandi, Mahdi
    出版 2014
    主题: “...Solder and soldering...”
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  3. 3
    Wetting behaviors of lead based solders on various substrates at different temperatures /
    由 Shaiful Anwar Ismail
    出版 2010
    主题: “...Solder and soldering....”
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  4. 4
    Effect of electromigration on the lead-free solder joint with addition of porous copper interlayer /
    由 Jannatun Adzura Adnan
    出版 2015
    主题: “...Solder and soldering....”
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  5. 5
    Solderability of Sn-Cu-based lead-free solder with low content of silver and indium /
    主题: “...Solder and soldering....”
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  6. 6
    Study the effect of isothermal aging on Sn-Ag-Cu (SAC) lead-free solder added with silicon carbide (SiC)
    主题: “...Solder and soldering...”
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  7. 7
    Development of Lead-Free Sn-0.7Cu-Si3N4 composite solders
    主题: “...Solder and solderingSolder and soldering...”
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  8. 8
    Study on solder paste statistical process control (SPC) using vision inspection /
    由 Chan, Gaik Tatt
    出版 1992
    主题: “...Solder and soldering. Automation....”
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  9. 9
    Material characterization of soft solder die attaches for power ICs /
    由 Wee, Seng Kee
    出版 1996
    主题: “...Solder and soldering....”
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  10. 10
    Interfacial analysis of carbon nanotubes-reinforced and graphene-reinforced Sn-1.0Ag-0.5Cu solder on electroless nickel/ immersion silver surface finish
    由 Krishna, Vidyatharran
    出版 2020
    主题: “...Solder and soldering...”
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  11. 11
    Evaluation of corrosive environment impact on low cost fe/A1 added SAC105 solder alloys /
    由 Nor Ilyana Muhd Nordin
    出版 2017
    主题: “...Solder and soldering....”
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  12. 12
    The effect of copper powder addition on spreading characteristics and mechanical behaviour of Sn-Ag-Cu solder /
    由 Angellia, Lian Dewi
    出版 2009
    主题: “...Solder and soldering....”
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  13. 13
    Effects of molybdenum nanoparticles on the interface between lead-free solder and nickel substrate /
    主题: “...Solder and soldering....”
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  14. 14
    Bismuth-argentum alloys as alternative high temperature lead-free solder
    由 Rosilli, Rohaizuan
    出版 2012
    主题: “...Solder and soldering...”
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  15. 15
    Microstructural characteristics and mechanical properties of Sn-Ag-Cu solders with minor additions of Al and Zn /
    由 Leong, Yee Mei
    出版 2020
    主题: “...Solder and soldering....”
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  16. 16
    Analysis of selected lead-free solders by optical emission spectroscopy /
    由 Yee, Chung Lee
    出版 2014
    主题: “...Solder and soldering....”
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  17. 17
    Ultrasonic assisted reflow soldering of lead free solder joint /
    由 Tan, Ai Ting
    出版 2017
    主题: “...Solder and soldering....”
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  18. 18
    Mechanical and thermal aging behaviors of lead free solder joint with addition of porous copper interlayer /
    由 Nashrah Hani Jamadon
    出版 2017
    主题: “...Solder and soldering....”
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  19. 19
    Development od SiC reinforced SnCu and SAC based lead-free solder composite via powder metallurgy route
    主题: “...Solder and soldering...”
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  20. 20
    The development of Sn-Cu-Ni lead free composite solder influence by non-metallic reinforcement
    主题: “...Solder and soldering...”
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