Thermal fluid-structure interaction analysis on flexible printed circuit board during reflow soldering.
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Main Author: | |
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Format: | UMK Etheses |
Language: | English |
Published: |
2021
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Online Access: | http://discol.umk.edu.my/id/eprint/10777/ http://discol.umk.edu.my/id/eprint/10777/1/MUHAMMAD%20IQBAL%20AHMAD.pdf |
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