The effects of the electroless copper coating to the thermal expansion behaviors of silicon carbide particles reinforced copper matrix composites for the electronic packaging applications
The demands for advanced thermal management materials with high thermal conductivity and low coefficient of thermal expansion (CTE) are expected to increase due to the technological progress in the thermal management hardware. Silicon carbide reinforced copper matrix (Cu-SiCp) composites are high...
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| Format: | Thesis |
| Language: | English |
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| Online Access: | http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/31222/1/Page%201-24.pdf http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/31222/2/Full%20text.pdf |
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