Azmi, K., Azuwir, M. N., Bashir, M. G., Chong, S. W., Purushothaman, D., Elsie, U. F., . . . Tunku Muhammad Nizar, T. M. The effects of the electroless copper coating to the thermal expansion behaviors of silicon carbide particles reinforced copper matrix composites for the electronic packaging applications.
توثيق أسلوب شيكاغو (الطبعة السابعة عشر)Azmi, Kamardin, et al. The Effects of the Electroless Copper Coating to the Thermal Expansion Behaviors of Silicon Carbide Particles Reinforced Copper Matrix Composites for the Electronic Packaging Applications.
توثيق جمعية اللغة المعاصرة MLA (الطبعة الثامنة)Azmi, Kamardin, et al. The Effects of the Electroless Copper Coating to the Thermal Expansion Behaviors of Silicon Carbide Particles Reinforced Copper Matrix Composites for the Electronic Packaging Applications.