Azmi, K., Azuwir, M. N., Bashir, M. G., Chong, S. W., Purushothaman, D., Elsie, U. F., . . . Tunku Muhammad Nizar, T. M. The effects of the electroless copper coating to the thermal expansion behaviors of silicon carbide particles reinforced copper matrix composites for the electronic packaging applications.
Chicago Style (17th ed.) CitationAzmi, Kamardin, et al. The Effects of the Electroless Copper Coating to the Thermal Expansion Behaviors of Silicon Carbide Particles Reinforced Copper Matrix Composites for the Electronic Packaging Applications.
MLA引文Azmi, Kamardin, et al. The Effects of the Electroless Copper Coating to the Thermal Expansion Behaviors of Silicon Carbide Particles Reinforced Copper Matrix Composites for the Electronic Packaging Applications.