Effect of isothermal aging to the intermetallic compound (IMC) growth of Sn-0.7Cu-1.0Si₃N₄ composite solder on copper substrate

The excessive growth of intermetallic compound (IMC) layer on solder joints has become a challenging to the electronic packaging industry. Excessive IMC growth is a barrier for the reliability of solder joints and the suppression of IMC is a target for most solder manufacturers. Thus, research stu...

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主要作者: Najib Saedi, Ibrahim
格式: Thesis
語言:English
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在線閱讀:http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/44267/1/P.1-24.pdf
http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/44267/2/Full%20Text.pdf
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