Effect of isothermal aging to the intermetallic compound (IMC) growth of Sn-0.7Cu-1.0Si₃N₄ composite solder on copper substrate
The excessive growth of intermetallic compound (IMC) layer on solder joints has become a challenging to the electronic packaging industry. Excessive IMC growth is a barrier for the reliability of solder joints and the suppression of IMC is a target for most solder manufacturers. Thus, research stu...
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| 格式: | Thesis |
| 語言: | English |
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| 在線閱讀: | http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/44267/1/P.1-24.pdf http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/44267/2/Full%20Text.pdf |
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