The development of Sn-Cu-Ni lead free composite solder influence by non-metallic reinforcement
For several decades, Sn-Pb alloys have been extensively used as soldering material in the electronic packaging industry. Even so due to the concern on the toxicity of lead in eutectic SnPb solders, researchers have been focussing on the development of new leadfree solders. The primary focus is to de...
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| Format: | Thesis |
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| Language: | English |
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| Online Access: | http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/77175/1/Page%201-24.pdf http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/77175/2/Full%20text.pdf http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/77175/4/Mohd%20Izrul%20Izwan.pdf |
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