The development of Sn-Cu-Ni lead free composite solder influence by non-metallic reinforcement

For several decades, Sn-Pb alloys have been extensively used as soldering material in the electronic packaging industry. Even so due to the concern on the toxicity of lead in eutectic SnPb solders, researchers have been focussing on the development of new leadfree solders. The primary focus is to de...

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Format:	Thesis
Language:	English
Subjects:	Solder and soldering Tin alloys SnPb solders
Online Access:	http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/77175/1/Page%201-24.pdf http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/77175/2/Full%20text.pdf http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/77175/4/Mohd%20Izrul%20Izwan.pdf
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spelling	my-unimap-771752022-11-24T07:40:57Z The development of Sn-Cu-Ni lead free composite solder influence by non-metallic reinforcement Norainiza, Saud, Dr. For several decades, Sn-Pb alloys have been extensively used as soldering material in the electronic packaging industry. Even so due to the concern on the toxicity of lead in eutectic SnPb solders, researchers have been focussing on the development of new leadfree solders. The primary focus is to develop a new generation of interconnect materials that is equipped with a combination of good mechanical, electrical and thermal properties that fulfil the requirement of electronic industry. In this project, a new generation of lead-free (Sn-Cu-Ni) solder alloy was developed to form a composite solder. Five new lead-free composite solders were successfully synthesized using the powder metallurgy method, which consists of mixing, compaction, and sintering process. This research also assisted by a hybrid microwave assisted sintering process, which showed significant advantages in processing compared to conventional sintering method, such as rapid heating rate, shortened sintering time, less energy consumption and less expensive equipment. Five non-metallic reinforcements (Silicon Nitride, Titanium Oxide, Silicon Carbide, Silicon, and Activated Carbon) with various percentages (0, 0.25, 0.5, 0.75, and 1.0 wt. %) were intentionally incorporated into the solder matrix. The microstructure, electrical, thermal, physical properties, and mechanical properties of the composite solders were investigated. Addition of reinforcement particle into a Sn-Cu-Ni solder matrix has led to improvement in thermal performance and mechanical performance. The result also has shown there are no change in the melting temperature and electrical performance. The presence of reinforcement’s particles was effective in retarding the interfacial intermetallic layer formation. The shear strength of composite solder were improved with addition of reinforcement particles. All of composite solder system also showed better wettability which improvement in contact angle on Cu-substrate compare with monolithic solder. XRD result showed that there are no new reaction phases occur in the new composite system. Overall, the Sn-Cu-Ni composite solder showed an improvement compared to the monolithic solder and the Sn-Cu-Ni+AC were the most preferable composite solder. Its excellent mechanical properties make the Sn-Cu-Ni+AC composite solder an alternative and ideal choice to replace current lead free solder in the electronic industry Universiti Malaysia Perlis (UniMAP) Thesis en http://dspace.unimap.edu.my:80/xmlui/handle/123456789/77175 http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/77175/3/license.txt 8a4605be74aa9ea9d79846c1fba20a33 http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/77175/1/Page%201-24.pdf c24bf5f8821957515c9f3c93625f280a http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/77175/2/Full%20text.pdf 27fb2d926210e999dc24ba3a32ce5ea0 http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/77175/4/Mohd%20Izrul%20Izwan.pdf 827027437795dc0ada697a2632783d22 Universiti Malaysia Perlis (UniMAP) Solder and soldering Tin alloys SnPb solders School of Materials Engineering
institution	Universiti Malaysia Perlis
collection	UniMAP Institutional Repository
language	English
advisor	Norainiza, Saud, Dr.
topic	Solder and soldering Tin alloys SnPb solders
spellingShingle	Solder and soldering Tin alloys SnPb solders The development of Sn-Cu-Ni lead free composite solder influence by non-metallic reinforcement
description	For several decades, Sn-Pb alloys have been extensively used as soldering material in the electronic packaging industry. Even so due to the concern on the toxicity of lead in eutectic SnPb solders, researchers have been focussing on the development of new leadfree solders. The primary focus is to develop a new generation of interconnect materials that is equipped with a combination of good mechanical, electrical and thermal properties that fulfil the requirement of electronic industry. In this project, a new generation of lead-free (Sn-Cu-Ni) solder alloy was developed to form a composite solder. Five new lead-free composite solders were successfully synthesized using the powder metallurgy method, which consists of mixing, compaction, and sintering process. This research also assisted by a hybrid microwave assisted sintering process, which showed significant advantages in processing compared to conventional sintering method, such as rapid heating rate, shortened sintering time, less energy consumption and less expensive equipment. Five non-metallic reinforcements (Silicon Nitride, Titanium Oxide, Silicon Carbide, Silicon, and Activated Carbon) with various percentages (0, 0.25, 0.5, 0.75, and 1.0 wt. %) were intentionally incorporated into the solder matrix. The microstructure, electrical, thermal, physical properties, and mechanical properties of the composite solders were investigated. Addition of reinforcement particle into a Sn-Cu-Ni solder matrix has led to improvement in thermal performance and mechanical performance. The result also has shown there are no change in the melting temperature and electrical performance. The presence of reinforcement’s particles was effective in retarding the interfacial intermetallic layer formation. The shear strength of composite solder were improved with addition of reinforcement particles. All of composite solder system also showed better wettability which improvement in contact angle on Cu-substrate compare with monolithic solder. XRD result showed that there are no new reaction phases occur in the new composite system. Overall, the Sn-Cu-Ni composite solder showed an improvement compared to the monolithic solder and the Sn-Cu-Ni+AC were the most preferable composite solder. Its excellent mechanical properties make the Sn-Cu-Ni+AC composite solder an alternative and ideal choice to replace current lead free solder in the electronic industry
format	Thesis
title	The development of Sn-Cu-Ni lead free composite solder influence by non-metallic reinforcement
title_short	The development of Sn-Cu-Ni lead free composite solder influence by non-metallic reinforcement
title_full	The development of Sn-Cu-Ni lead free composite solder influence by non-metallic reinforcement
title_fullStr	The development of Sn-Cu-Ni lead free composite solder influence by non-metallic reinforcement
title_full_unstemmed	The development of Sn-Cu-Ni lead free composite solder influence by non-metallic reinforcement
title_sort	development of sn-cu-ni lead free composite solder influence by non-metallic reinforcement
granting_institution	Universiti Malaysia Perlis (UniMAP)
granting_department	School of Materials Engineering
url	http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/77175/1/Page%201-24.pdf http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/77175/2/Full%20text.pdf http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/77175/4/Mohd%20Izrul%20Izwan.pdf
_version_	1776104245445001216

The development of Sn-Cu-Ni lead free composite solder influence by non-metallic reinforcement

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