The development of Sn-Cu-Ni lead free composite solder influence by non-metallic reinforcement

For several decades, Sn-Pb alloys have been extensively used as soldering material in the electronic packaging industry. Even so due to the concern on the toxicity of lead in eutectic SnPb solders, researchers have been focussing on the development of new leadfree solders. The primary focus is to de...

全面介绍

Saved in:
书目详细资料
格式: Thesis
语言:English
主题:
在线阅读:http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/77175/1/Page%201-24.pdf
http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/77175/2/Full%20text.pdf
http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/77175/4/Mohd%20Izrul%20Izwan.pdf
标签: 添加标签
没有标签, 成为第一个标记此记录!

相似书籍