Hot air solder levelling (HASL) process parameters optimization for SN100CL

Reliability of electronic packaging has now become the most critical factor in electronic industries. The prediction of solder joint failure and its shelf life becomes more challenging as the increasing demand for superior performance of electronic devices. In electronic packaging, surface finish p...

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Format:	Thesis
Language:	English
Subjects:	Solder and soldering Hot air solder levelling (HASL) Solder Solder joint
Online Access:	http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/77184/1/Page%201-24.pdf http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/77184/2/Full%20text.pdf http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/77184/4/Fatin%20Afeeqa.pdf
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id	my-unimap-77184
record_format	uketd_dc
spelling	my-unimap-771842022-11-24T08:27:58Z Hot air solder levelling (HASL) process parameters optimization for SN100CL Che Mohd Ruzaidi, Ghazali, Assoc. Prof. Reliability of electronic packaging has now become the most critical factor in electronic industries. The prediction of solder joint failure and its shelf life becomes more challenging as the increasing demand for superior performance of electronic devices. In electronic packaging, surface finish plays an important role for soldering and assemblies process. This study was made to determine the solderability of SN100CL coating surface and optimized the Hot Air Solder Levelling (HASL) process parameters. This research work was divided into two phases. The first phase is to study the relationship between solderability and the total coating thickness, free solder thickness and interfacial intermetallic compound (IMC). The second phase was the investigation of different composition of Germanium (Ge) in SN100CL solder. Five different composition of Ge used are 0 wt%, 0.002 wt%, 0.006 wt%, 0.010 wt% and 0.020 wt% in Sn-0.7Cu-0.05Ni solder alloy. This research reveals the effect on solderability of SN100CL coating with different Ge compositions. Gen3 wetting balance test method was used to evaluate the solderability. The quality of wetting was evaluated by relative comparison on the wetting time and maximum wetting force exerted on the coated copper surface. It was found that the wetting time was longer and the maximum wetting force was lower with decreasing of free solder thickness layer due to growth of interfacial IMC layer and produced less wettable surface of solder coating. Apart from that, 0.006 wt% of Ge was observed to have the best composition of Ge in SN100CL solder. The results was determined with SN100CL coated surface when introduced to reflowed and aged conditions. The IMC and free solder thickness of 0w wt% and 0.006 wt% was observed under Scanning Electron Microscope (SEM) and the results shows that IMC of 0 wt% Ge growth higher compared to 0.006 wt% of Ge. Sn-0.7Cu-0.05Ni+0.006Ge solder alloy was then deployed in HASL process. The parameter optimization was performed and the good HASL coating was observed under SEM. Overall, the solderability are found to be affected by free solder thickness and 0.006 wt% of Ge shows the best composition in HASL process with 2 seconds and 5 seconds of dwell time and level time respectively. Universiti Malaysia Perlis (UniMAP) Thesis en http://dspace.unimap.edu.my:80/xmlui/handle/123456789/77184 http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/77184/3/license.txt 8a4605be74aa9ea9d79846c1fba20a33 http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/77184/1/Page%201-24.pdf f05ce93d2bf8e097edca41e2d43bc375 http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/77184/2/Full%20text.pdf 5128e863bd8b0b256cbda4ff0b8d47cf http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/77184/4/Fatin%20Afeeqa.pdf 840a4ad934d9127a0ee04dcb195f8e6e Universiti Malaysia Perlis (UniMAP) Solder and soldering Hot air solder levelling (HASL) Solder Solder joint School of Materials Engineering
institution	Universiti Malaysia Perlis
collection	UniMAP Institutional Repository
language	English
advisor	Che Mohd Ruzaidi, Ghazali, Assoc. Prof.
topic	Solder and soldering Hot air solder levelling (HASL) Solder Solder joint
spellingShingle	Solder and soldering Hot air solder levelling (HASL) Solder Solder joint Hot air solder levelling (HASL) process parameters optimization for SN100CL
description	Reliability of electronic packaging has now become the most critical factor in electronic industries. The prediction of solder joint failure and its shelf life becomes more challenging as the increasing demand for superior performance of electronic devices. In electronic packaging, surface finish plays an important role for soldering and assemblies process. This study was made to determine the solderability of SN100CL coating surface and optimized the Hot Air Solder Levelling (HASL) process parameters. This research work was divided into two phases. The first phase is to study the relationship between solderability and the total coating thickness, free solder thickness and interfacial intermetallic compound (IMC). The second phase was the investigation of different composition of Germanium (Ge) in SN100CL solder. Five different composition of Ge used are 0 wt%, 0.002 wt%, 0.006 wt%, 0.010 wt% and 0.020 wt% in Sn-0.7Cu-0.05Ni solder alloy. This research reveals the effect on solderability of SN100CL coating with different Ge compositions. Gen3 wetting balance test method was used to evaluate the solderability. The quality of wetting was evaluated by relative comparison on the wetting time and maximum wetting force exerted on the coated copper surface. It was found that the wetting time was longer and the maximum wetting force was lower with decreasing of free solder thickness layer due to growth of interfacial IMC layer and produced less wettable surface of solder coating. Apart from that, 0.006 wt% of Ge was observed to have the best composition of Ge in SN100CL solder. The results was determined with SN100CL coated surface when introduced to reflowed and aged conditions. The IMC and free solder thickness of 0w wt% and 0.006 wt% was observed under Scanning Electron Microscope (SEM) and the results shows that IMC of 0 wt% Ge growth higher compared to 0.006 wt% of Ge. Sn-0.7Cu-0.05Ni+0.006Ge solder alloy was then deployed in HASL process. The parameter optimization was performed and the good HASL coating was observed under SEM. Overall, the solderability are found to be affected by free solder thickness and 0.006 wt% of Ge shows the best composition in HASL process with 2 seconds and 5 seconds of dwell time and level time respectively.
format	Thesis
title	Hot air solder levelling (HASL) process parameters optimization for SN100CL
title_short	Hot air solder levelling (HASL) process parameters optimization for SN100CL
title_full	Hot air solder levelling (HASL) process parameters optimization for SN100CL
title_fullStr	Hot air solder levelling (HASL) process parameters optimization for SN100CL
title_full_unstemmed	Hot air solder levelling (HASL) process parameters optimization for SN100CL
title_sort	hot air solder levelling (hasl) process parameters optimization for sn100cl
granting_institution	Universiti Malaysia Perlis (UniMAP)
granting_department	School of Materials Engineering
url	http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/77184/1/Page%201-24.pdf http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/77184/2/Full%20text.pdf http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/77184/4/Fatin%20Afeeqa.pdf
_version_	1776104247600873472

Hot air solder levelling (HASL) process parameters optimization for SN100CL

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