APA (7th ed.) Citation

Thermal-mechanical analysis of bonding pad in insulated gate bipolar transistor.

Chicago Style (17th ed.) Citation

Thermal-mechanical Analysis of Bonding Pad in Insulated Gate Bipolar Transistor.

MLA (8th ed.) Citation

Thermal-mechanical Analysis of Bonding Pad in Insulated Gate Bipolar Transistor.

Warning: These citations may not always be 100% accurate.