Study the effect of isothermal aging on Sn-Ag-Cu (SAC) lead-free solder added with silicon carbide (SiC)
The usage of composite solder is one of the method in improving stability of the solder joints. Addition of certain particles such SiC to form a composite solder has been given greater attention since it can enhance the mechanical properties of solder and has been proven by other researchers. Thi...
Saved in:
| 格式: | Thesis |
|---|---|
| 語言: | English |
| 主題: | |
| 在線閱讀: | http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/77544/1/Page%201-24.pdf http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/77544/2/Full%20text.pdf http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/77544/3/Declaration%20Form.pdf |
| 標簽: |
添加標簽
沒有標簽, 成為第一個標記此記錄!
|