Intermetallics evolution and shear strength of carbon nanotubes- reinforced sn-5sb solder on copper board
Critical evaluation of interconnection materials developed from composite solder materials and a comprehensive comparison of the joints with the host solder alloy are cardinal to the quest of divulging a more decent and dependable alternative to the existing solder candidate. In this study, the effe...
Saved in:
| 主要作者: | |
|---|---|
| 格式: | Thesis |
| 语言: | English |
| 出版: |
2015
|
| 主题: | |
| 在线阅读: | http://psasir.upm.edu.my/id/eprint/56593/1/FK%202015%2014RR.pdf |
| 标签: |
添加标签
没有标签, 成为第一个标记此记录!
|