Study On The Wetting Properties, Interfacial Reactions And Mechanical Properties Of Sn-Zn And Sn-Zn-Bi Solders On Copper Metallization
Secara praktiknya kesemua pemasangan elektronik masa kini menggunakan pateri eutektik Sn-Pb pada antara penyambung. Practically all microelectronic assemblies in use today utilize Sn-Pb eutectic solder for interconnection.
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| Main Author: | |
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| Format: | Thesis |
| Language: | English |
| Published: |
2007
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| Subjects: | |
| Online Access: | http://eprints.usm.my/29392/1/Study_on_the_wetting_properties%2C_interfacial_reactions_and_mechanical.pdf |
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