Study On The Wetting Properties, Interfacial Reactions And Mechanical Properties Of Sn-Zn And Sn-Zn-Bi Solders On Copper Metallization

Secara praktiknya kesemua pemasangan elektronik masa kini menggunakan pateri eutektik Sn-Pb pada antara penyambung. Practically all microelectronic assemblies in use today utilize Sn-Pb eutectic solder for interconnection.

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Bibliographic Details
Main Author:	Mayappan, Ramani
Format:	Thesis
Language:	English
Published:	2007
Subjects:	Q Science
Online Access:	http://eprints.usm.my/29392/1/Study_on_the_wetting_properties%2C_interfacial_reactions_and_mechanical.pdf
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id	my-usm-ep.29392
record_format	uketd_dc
spelling	my-usm-ep.293922017-03-22T02:23:49Z Study On The Wetting Properties, Interfacial Reactions And Mechanical Properties Of Sn-Zn And Sn-Zn-Bi Solders On Copper Metallization 2007-09 Mayappan, Ramani Q Science Secara praktiknya kesemua pemasangan elektronik masa kini menggunakan pateri eutektik Sn-Pb pada antara penyambung. Practically all microelectronic assemblies in use today utilize Sn-Pb eutectic solder for interconnection. 2007-09 Thesis http://eprints.usm.my/29392/ http://eprints.usm.my/29392/1/Study_on_the_wetting_properties%2C_interfacial_reactions_and_mechanical.pdf application/pdf en public phd doctoral USM Pusat Pengajian Sains Fizik
institution	Universiti Sains Malaysia
collection	USM Institutional Repository
language	English
topic	Q Science
spellingShingle	Q Science Mayappan, Ramani Study On The Wetting Properties, Interfacial Reactions And Mechanical Properties Of Sn-Zn And Sn-Zn-Bi Solders On Copper Metallization
description	Secara praktiknya kesemua pemasangan elektronik masa kini menggunakan pateri eutektik Sn-Pb pada antara penyambung. Practically all microelectronic assemblies in use today utilize Sn-Pb eutectic solder for interconnection.
format	Thesis
qualification_name	Doctor of Philosophy (PhD.)
qualification_level	Doctorate
author	Mayappan, Ramani
author_facet	Mayappan, Ramani
author_sort	Mayappan, Ramani
title	Study On The Wetting Properties, Interfacial Reactions And Mechanical Properties Of Sn-Zn And Sn-Zn-Bi Solders On Copper Metallization
title_short	Study On The Wetting Properties, Interfacial Reactions And Mechanical Properties Of Sn-Zn And Sn-Zn-Bi Solders On Copper Metallization
title_full	Study On The Wetting Properties, Interfacial Reactions And Mechanical Properties Of Sn-Zn And Sn-Zn-Bi Solders On Copper Metallization
title_fullStr	Study On The Wetting Properties, Interfacial Reactions And Mechanical Properties Of Sn-Zn And Sn-Zn-Bi Solders On Copper Metallization
title_full_unstemmed	Study On The Wetting Properties, Interfacial Reactions And Mechanical Properties Of Sn-Zn And Sn-Zn-Bi Solders On Copper Metallization
title_sort	study on the wetting properties, interfacial reactions and mechanical properties of sn-zn and sn-zn-bi solders on copper metallization
granting_institution	USM
granting_department	Pusat Pengajian Sains Fizik
publishDate	2007
url	http://eprints.usm.my/29392/1/Study_on_the_wetting_properties%2C_interfacial_reactions_and_mechanical.pdf
_version_	1747820140759613440

Study On The Wetting Properties, Interfacial Reactions And Mechanical Properties Of Sn-Zn And Sn-Zn-Bi Solders On Copper Metallization

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